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Stamping Simulation in LS-DYNA®


  • Xin­hai Zhu
  • Jin Wu
  • Jinglin Zheng


  • $650
  • $325 for students

What's Included

  • Two days of in­struc­tion
  • Class notes

Stamping Simulation in LS-DYNA®


  • Fa­mil­iar­i­ty with stamp­ing process­es
  • Ba­sic un­der­stand­ing of the LS-DY­NA key­word for­mat


This class in­tro­duces how to per­form stamp­ing sim­u­la­tions in LS-DY­NA. We will dis­cuss how to im­prove pre­dic­tion ac­cu­ra­cy for spring­back and forma­bil­i­ty. LS-FORM, our ded­i­cat­ed GUI for stamp­ing ap­pli­ca­tions, will al­so be in­tro­duced. The class will al­so overview ther­mal-me­chan­i­cal cou­pling in hot form­ing sim­u­la­tions.


  1. In­tro­duc­tion of stamp­ing ap­pli­ca­tions in LS-DY­NA
  2. Spring­back pre­dic­tion ver­sus forma­bil­i­ty analy­sis
  3. Ma­te­r­i­al mod­els se­lec­tion
  4. Some typ­i­cal ap­pli­ca­tions
  5. LS-FORM
    1. Set­ting up the in­put
    2. Post-pro­cess­ing the re­sults
  6. Ther­mal-me­chan­i­cal cou­pling for hot form­ing analy­sis